Semiconductor module having sliding case and manufacturing method thereof

ABSTRACT

There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2012-0149148 filed on Dec. 20, 2012, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor module and amanufacturing method thereof, and more particularly, to a powersemiconductor module able to be easily manufactured.

2. Description of the Related Art

Recently, market demand for small, light-weight portable electronicapparatuses has rapidly increased, and thus electronic componentsmounted therein have also been required to be small-sized andlightweight to satisfy market demand.

Accordingly, in addition to a method of reducing a size of an electronicelement itself, a method of installing as many elements and conductingwires as possible in a small defined space is an important considerationin semiconductor module design.

In addition, a large amount of heat is generated when a powersemiconductor element is driven. Such heat has an influence on alifespan and operation of an electronic product, and thus, heatdissipation of a module is also an important issue.

To this end, a power semiconductor module uses a structure in which botha power element and a control element are mounted on one surface of acircuit substrate and a heat sink used to dissipate heat is disposed onthe other surface of the circuit substrate.

Such a power semiconductor module mainly uses a method of molding theexterior of the power semiconductor module with a molding member so asto externally protect the circuit substrate or elements.

However, a semiconductor module including the molding member requires aprocess of inserting the circuit substrate into a mold, injecting amolding material into the mold, and curing the molded material, making amanufacturing process disadvantageously complicated.

Accordingly, a semiconductor module that may be easily manufactured anda manufacturing method thereof are required.

RELATED ART DOCUMENT

-   (Patent Document 1) Korean Patent Laid-Open Publication No.    2007-0065207

SUMMARY OF THE INVENTION

An aspect of the present invention provides a semiconductor module thatis easily manufactured and a manufacturing method thereof.

Another aspect of the present invention provides a semiconductor modulehaving a case and a manufacturing method thereof.

According to an aspect of the present invention, there is provided asemiconductor module including: a module substrate on which at least oneelectronic element is mounted; at least one external connection terminalfastened to the module substrate; and a case formed by coupling a firstcase and a second case, wherein the first case and the second caseaccommodate the module substrate at both ends of the module substrateand are coupled to each other.

The case may include at least one moving slit in which the externalconnection terminal is disposed when the first case and the second caseare coupled to each other.

The moving slit may be formed to have a width corresponding to that ofthe external connection terminal.

The moving slit may include at least one fixing projection inwardlyprotruded in such a manner that a width of the moving slit is reduced,in a side thereof in which the external connection terminal is finallydisposed.

One of the first case and the second case may include at least oneinsertion projection protruded outwardly, and the other thereof mayinclude at least one accommodating groove into which the insertionprojection is inserted.

The first case and the second case may be formed such that edges of thefirst case and the second case in contact with each other are engagedwith each other.

The first case and the second case may include substrate accommodationparts to which the module substrate is slidably coupled.

The semiconductor module may further include: a molding unit filling aninterior of the case.

The first case and the second case may be formed to have the same shape.

According to another aspect of the present invention, there is provideda semiconductor module including: a module substrate on which at leastone electronic element is mounted; at least one external connectionterminal fastened to the module substrate; and a case formed byaccommodating the module substrate in a first case and a second case andcoupling the module substrate and the first case and the second case,wherein the module substrate is inserted into the first case and thesecond case in a sliding manner and coupled to the first case and thesecond case.

According to another aspect of the present invention, there is provideda method of manufacturing a semiconductor module, the method including:mounting at least one electronic element and at least one externalconnection element on a module substrate; disposing a first case and asecond case at both ends of the module substrate; and coupling the firstcase and the second case to the module substrate by moving the firstcase and the second case so as to contact each other.

The coupling of the first case and the second case to the modulesubstrate may include: coupling the first case and the second case tothe module substrate by inserting the module substrate into the firstcase and the second case in a sliding manner.

The coupling of the first case and the second case to the modulesubstrate may include: disposing the module substrate in substrateaccommodation parts formed in the first case and the second case anddisposing the external connection terminal in the moving slit formed inthe first case and the second case.

The method may further include: forming a molding unit by filling aninterior of the case with a molding material.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a schematic perspective view of a semiconductor moduleaccording to an embodiment of the present invention;

FIG. 2 is a bottom perspective view of the semiconductor module of FIG.1;

FIG. 3 is an exploded perspective view of the semiconductor module ofFIG. 2;

FIG. 4 is an enlarged view of portion A of FIG. 2;

FIG. 5 is an enlarged view of portion B of FIG. 3;

FIG. 6 is a view illustrating a case binding structure according toanother embodiment of the present invention; and

FIGS. 7 through 9 are views illustrating a method of manufacturing asemiconductor module according to an embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. The invention may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the invention to thoseskilled in the art. In the drawings, the shapes and dimensions ofelements may be exaggerated for clarity, and the same reference numeralswill be used throughout to designate the same or like elements.

FIG. 1 is a schematic perspective view of a semiconductor moduleaccording to an embodiment of the present invention. FIG. 2 is a bottomperspective view of the semiconductor module of FIG. 1. FIG. 3 is anexploded perspective view of the semiconductor module of FIG. 2.

FIG. 4 is an enlarged view of portion A of FIG. 2. FIG. 5 is an enlargedview of portion B of FIG. 3.

Referring to FIGS. 1 through 5, a semiconductor module 100 according toan embodiment of the present invention may include a module substrate10, electronic elements 11, external connection terminals 60, and a case30.

The module substrate 10 may be a printed circuit board (PCB), a ceramicsubstrate, a pre-molded substrate, a direct bonded copper (DBC)substrate, or an insulated metal substrate (IMS).

A mounting electrode (not shown) used to mount the electronic elements11 to later be described or a wire pattern 13 used to electricallyconnect the mounting electrodes may be formed on the module substrate10.

The wire pattern 13 may use a general layer forming method, for example,chemical vapor deposition (CVD) and physical vapor deposition (PVD) ormay be formed by electrolysis plating or electroless plating. Also, thewire pattern 13 may include a conductive material such as metal. Forexample, the wire pattern 13 may include aluminum, an aluminum alloy,copper, a copper alloy, or a combination thereof.

One or more electronic elements 11 may be mounted on one surface of themodule substrate 10.

The electronic elements 11 according to the present embodiment mayinclude power elements 12 and control elements 13.

The power elements 12 may be power circuit elements for power conversionto control power, or power control, such as a servo driver, an inverter,a power regulator, a converter, and the like.

For example, the power elements 12 may include power MOSFETs, bipolarjunction transistors (BJTs), insulated-gate bipolar transistors (IGBTs),diodes, or a combination thereof. That is, in the present embodiment,the power elements 12 may include all or a portion of the elements.

In particular, a plurality of pairs of the power elements 12 may beconfigured, each pair of the power elements 12 may include an IGBT and adiode, according to the embodiment of the present invention. However,this is merely provided by way of example, and the present invention isnot necessarily limited thereto.

The control elements 22 may be electrically connected to the powerelements 12 through the wire pattern 13 or a bonding wire (not shown),thereby controlling operations of the power elements 12.

The control elements 22 may be, for example, microprocessors, and mayfurther include passive elements such as a resistor, an inverter, or acondenser, or active elements such as a transistor.

Meanwhile, a single control element 22 or a plurality of the controlelements 22 may be provided for a single power device 12. That is, typesand amounts of the control devices 22 may be appropriately selecteddepending on types of and amounts of the power devices 12.

In a case in which the electronic devices 11 are electrically connectedto the module substrate 10 through the bonding wire, the electronicelements 11 may be attached to one surface of the module substrate 10 bya bonding member (not shown). In this regard, the bonding member may beconductive or non-conductive. For example, the bonding member may beformed by using a conductive solder, a conductive paste, or a tape.Also, a solder, metal epoxy, a metal paste, resin-based epoxy, or abonding tape having excellent heat resistance, or the like may be usedas the bonding member.

However, the construction of the present invention is not limitedthereto. The electronic elements 11 and the module substrate 10 may beelectrically connected using various methods such as flip chip bonding,a solder ball method, or the like, if necessary.

The external connection terminals 60 include a plurality of leads thatmay be classified as external leads connected to an external substrate(not shown) and internal leads connected to the module substrate 10.That is, the external leads may indicate a part exposed to the outsideof the case 30, and the internal leads may indicate apart disposedwithin the case 30.

Meanwhile, an example of a case in which the external connectionterminals 60 and the electronic elements 11 are electrically connectedto each other through the wire pattern 13 formed on the module substrate10 is described in the present embodiment, but the present invention isnot limited thereto. The external connection terminals 60 and theelectronic elements 11 are connected using various methods such as usingthe bonding wire if necessary.

The external connection terminals 60 may be formed of a material such ascopper (Cu) or aluminum (Al), but the present invention is not limitedthereto.

A molding unit 40 may seal the module substrate 10 and the electronicelements 11 in such a manner as to fill the inner space of the case 30that will later be described. That is, the molding unit 40 is formed tocover and seal the electronic elements 11 and the internal leads of theexternal connection terminals 60 bonded to the module substrate 10 tothereby protect the electronic elements 11 from an external environment.Also, the molding unit 40 surrounds the electronic elements 11 to fixthe electronic elements 11 therein, thereby safely protecting theelectronic elements 11 from an external impact.

The molding unit 40 may be formed of an insulating material such asresin or the like. In particular, a material having high thermalconductivity such as a silicon gel, a thermally conductive epoxy, apolyimide, etc. may be used.

Meanwhile, in a case in which the electronic elements 11 and the modulesubstrate 10 can only be protected by using the case 30 that will laterbe described, the molding unit 40 according to the present embodimentmay be omitted. That is, the molding unit 40 may be added or omitted ifnecessary.

The case 30 forms an overall exterior of the semiconductor module 100and protects the electronic elements 11 and the module substrate 10 fromthe external environment.

The case 30 according to the present embodiment may be coupled to themodule substrate 10 at both ends of the module substrate 10. To thisend, the case 30 may include a first case 30 a and a second case 30 b.

The first case 30 a and the second case 30 b may have the same shapessymmetrically with respect to each other, disposed at both ends of themodule substrate 10 to face each other, and coupled to each other. Asthe first case 30 a and the second case 30 b are coupled to each other,an accommodation space for accommodating the electronic elements 11 andthe module substrate 10 therein is formed in the case 30.

The case 30 accommodates the electronic elements 11 and the modulesubstrate 10 therein and concurrently fixes the module substrate 10 inthe case 30. To this end, the case 30 according to the presentembodiment may include substrate accommodation units 32 and moving slits34.

The substrate accommodation units 32 may be formed as a space in whichthe module substrate 10 is inserted and fixed.

The module substrate 10 according to the present embodiment is insertedinto the substrate accommodation units 32 in a sliding manner andcoupled to the case 30. Thus, the substrate accommodation units 32 maybe formed as a space having a size corresponding to an exterior (forexample, a length and a thickness) of the module substrate 10 in such amanner that the module substrate 10 may be slidably coupled to thesubstrate accommodation units 32.

The substrate accommodation units 32 may be respectively formed in thefirst case 30 a and the second case 30 b and may include opening units33 each having a partially open surface. The opening units 33 are usedas spaces in which the electronic elements 11 are disposed. Thus, theelectronic elements 11 mounted on the module substrate 10 and protrudedtoward one side of the module substrate 10 may be disposed in such amanner as to pass through the opening units 33, and thus the electronicelements 11 may be easily disposed in the case 30.

The moving slits 34 may be formed as spaces in which the externalconnection terminals 60 of the module substrate 10 are inserted. Thus,the moving slits 34 are formed in a lower surface of the case 30 inwhich the external connection terminals 60 are disposed. Also, thenumber of the moving slits 34 may be identical to the number of theexternal connection terminals 60.

The moving slits 34 are formed in the respective first case and secondcase 30 a and 30 b to have a symmetrical structure in the presentembodiment. This is because of the structure in which all the externalconnection terminals 60 are disposed in both ends of the first case 30 aand the second case 30 b. Thus, the structure of the present inventionis not limited thereto. The moving slits 34 may be formed in one of thefirst case 30 a and the second case 30 b according to a dispositionstructure of the external connection terminals 60 or may be formed tohave a non-symmetrical structure.

The moving slits 34 are used as paths through which the externalconnection terminals 60 move toward the side of the case 30 when thecase 30 and the module substrate 10 are coupled to each other. Thus, awidth of the moving slits 34 may be the same as or slightly greater thana width of the external connection terminals 60. Also, the moving slits34 are formed lengthwise along the movement paths of the externalconnection terminals 60.

Also, at least one fixing projection 35 may be formed in a side of eachmoving slit 34, i.e., in a side in which the external connectionterminals 60 are finally disposed.

The fixing projection 35 may be inwardly protruded in such a manner thatthe width of each moving slit 34 is reduced. An example of a case inwhich the two fixing projections 35 are formed to face each other ineach moving slit 34 is described in the present embodiment. However, thepresent invention is not limited thereto. Various modificationsincluding formation of a single fixing projection 35 in each moving slit34 may be possible if necessary.

The fixing projection 35 may be provided to fix each external connectionterminal 60 disposed in a side of the moving slit 34. That is, if theexternal connection terminal 60 is disposed in a side of the moving slit34 as the case 30 and the module substrate 10 are coupled to each other,the movements of the external connection terminal 60 may be restrictedby the fixing projection 35.

If an external force is applied to the external connection terminal 60in a state in which the fixing projection 35 is not formed, the externalforce is applied to a bonding portion of the external connectionterminal 60 and the module substrate 10. Thus, in this case, the bondingportion may be easily damaged.

However, in a case in which the movements of the external connectionterminal 60 is fixed by using the fixing projection 35 as in the presentembodiment, the external force applied to the external connectionterminal 60 is applied to the external connection terminal 60 and thefixing projection 35, thereby preventing the bonding portion from beingdamaged.

Also, the case 30 according to the present embodiment may be formed bycoupling the first case 30 a and the second case 30 b to each other byinsertion binding. As shown in FIG. 5, the semiconductor module 100according to the present embodiment may be configured in such a mannerthat an insertion projection 37 is formed in the first case 30 a, anaccommodation groove 38 is formed in the second case 30 b, and theinsertion projection 37 of the first case 30 a is inserted into theaccommodation groove 38 in the second case 30 b to be fitted therein.Accordingly, the case 30 and the module substrate 10 may be fixed andcoupled to each other merely by binding without a separate fixingmember.

However, the configuration of the present invention is not limitedthereto, and may be modified in various manners as shown in FIG. 6 inorder to increase binding force.

FIG. 6 is a view illustrating a case binding structure according toanother embodiment of the present invention. Referring to FIG. 6, thefirst case 30 a and the second case 30 b may include protrusions 39 aand grooves 39 b corresponding to the protrusions 39 a and aresymmetrically with respect to each other and engaged with each other.The protrusions 39 a and the grooves 39 b corresponding thereof arecoupled to each other in such a manner as to be engaged with each other,such that the first case 30 a and the second case 30 b are fixedlycoupled to each other.

In this case, binding force between the first case 30 a and the secondcase 30 b may be increased.

Also, the first case 30 a and the second case 30 b may be fixed andcoupled to each other by using a separate fixing member such as a screwor may be integrally formed by bonding the first case 30 a and thesecond case 30 b to each other using a bonding member disposedtherebetween. In this regard, a bonding agent or a bonding tape may beused as the bonding member.

The case 30 according to the present embodiment may be formed of aninsulating material. That is, polyphenylene sulfide (PPS), liquidpolyester (LCP), polybutyleneterephthalate (PBT), polyethyleneterephthalate (PET), phenol based resin, or the like may be used as thematerial of the case 30 but the present invention is not limitedthereto. For example, various applications including formation of theinterior of the case 30 by using a metal material and then coating theexterior thereof by using the insulating material may be possible, ifnecessary.

Meanwhile, although not shown, the semiconductor module 100 according tothe present embodiment may further include a heat dissipation unitoutside of the case 30. The heat dissipation unit may be fastened to atleast one of external surfaces of the case 30 to dissipate heatgenerated from the electronic elements 11 to the outside.

The heat dissipation unit may be a heat sink formed of a metal capableof effectively dissipating heat to the outside. Aluminum (Al) or analuminum alloy that can be easily used at a relatively low cost as wellas has excellent heat conductive characteristics may be used as thematerial of the heat dissipation unit. However, the present invention isnot limited thereto. A material having the excellent heat conductivecharacteristics may be used in various ways even in the case that thematerial is not metal, such as a material like graphite.

Also, a plurality of projections or slits may be formed outside the heatdissipation unit so as to expand an external area.

Next, a method of manufacturing a semiconductor module according to thepresent embodiment will now be described.

FIGS. 7 through 9 are views illustrating a method of manufacturing asemiconductor module according to an embodiment of the presentinvention.

Referring to FIGS. 7 through 9, in the method of manufacturing thesemiconductor module according to the present embodiment, the electronicelements 11 and the external connection terminals 60 are mounted on themodule substrate 10 as shown in FIG. 7.

Next, as shown in FIG. 8, the first case 30 a and the second case 30 bare disposed at both ends of the module substrate 10 on which theelectronic elements 11 and the external connection terminals 60 aremounted. In this regard, the module substrate 10 may be inserted intothe substrate accommodation units 32 of the first case 30 a and thesecond case 30 b, and the external connection terminals 60 may beinserted into the moving slits 34.

Thereafter, as shown in FIG. 8, the first case 30 a and the second case30 b move toward the center thereof in such that the first case 30 a andthe second case 30 b may be coupled to each other. If the first case 30a and the second case 30 b contact each other, the insertion projection37 of the first case 30 a is inserted into the accommodation groove 38in the second case 30 b, and, as shown in FIG. 9, the first case 30 aand the second case 30 b may be fixed and coupled to each other.

During this process, the module substrate 10 is accommodated in andcoupled to the substrate accommodation units 32 of the first case 30 aand the second case 30 b in a sliding manner. Thus, the module substrate10 may be fixed and coupled to the case 30 only through the process ofcoupling the first case 30 a and the second case 30 b to each otherwithout a separate fixing member or process.

Thereafter, the molding unit 40 is formed by filling the inside of thecase 30 with a molding material. This process may be performed through aprocess of injecting a liquid molding material into the inside of thecase 30 through the moving slits 34 and then curing the liquid moldingmaterial.

A process of coupling the heat dissipation unit to the outside of thecase 30 may be further performed if necessary. The semiconductor module100 according to the present embodiment as shown in FIGS. 1 and 2 may becompletely manufactured.

As set forth above, the above-configured semiconductor module and themanufacturing method thereof according to embodiments of the presentinvention completely form a single case by accommodating a modulesubstrate in a first case and a second case at both sides of the modulesubstrate and coupling the module substrate and the first and secondcases. In this regard, external connection terminals may be easilydisposed in the case by using moving slits of the case, and the modulesubstrate may be coupled to the case in a sliding manner.

Therefore, the module substrate and the case may be very easily coupledto each other, and thus the semiconductor module can be advantageouslymanufactured easily. Also, a variety of semiconductor modules havingexternal connection terminals, i.e. lead frames, can be easily applied.

In addition, in the semiconductor module according to the presentinvention, the molding unit may be omitted if necessary, and theexterior of the semiconductor module may be formed only using the case,and thus a conventional process of forming the molding unit can beomitted. Thus, a manufacturing processing can be simplified.

The above-described semiconductor module and the manufacturing methodthereof according to embodiments of the present invention are notlimited to the above-described embodiments and may have variousapplications. For example, although an example of a case in which thecase of the semiconductor module is generally formed in a rectangularshape in the above-described embodiments, the present invention is notlimited thereto. That is, the case may be formed in various shapes suchas a cylindrical shape or a polygonal shape if necessary.

While the present invention has been shown and described in connectionwith the embodiments, it will be apparent to those skilled in the artthat modifications and variations can be made without departing from thespirit and scope of the invention as defined by the appended claims.

1. A semiconductor module comprising: a module substrate on which at least one electronic element is mounted; at least one external connection terminal fastened to the module substrate; and a case formed by coupling a first case and a second case, wherein: the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other, the case includes at least one moving slit in which the external connection terminal is disposed when the first case and the second case are coupled to each other, and the moving slit includes at least one fixing projection inwardly protruded in such a manner that a width of the moving slit is reduced, in a side thereof in which the external connection terminal is finally disposed.
 2. (canceled)
 3. The semiconductor module of claim 1, wherein the moving slit is formed to have a width corresponding to that of the external connection terminal.
 4. (canceled)
 5. The semiconductor module of claim 1, wherein one of the first case and the second case includes at least one insertion projection protruded outwardly, and the other thereof includes at least one accommodating groove into which the insertion projection is inserted.
 6. The semiconductor module of claim 1, wherein the first case and the second case are formed such that edges of the first case and the second case in contact with each other are engaged with each other.
 7. The semiconductor module of claim 1, wherein the first case and the second case include substrate accommodation parts to which the module substrate is slidably coupled.
 8. The semiconductor module of claim 1, further comprising a molding unit filling an interior of the case.
 9. The semiconductor module of claim 1, wherein the first case and the second case are formed to have the same shape.
 10. A semiconductor module comprising: a module substrate on which at least one electronic element is mounted; at least one external connection terminal fastened to the module substrate; and a case formed by accommodating the module substrate in a first case and a second case and coupling the module substrate and the first case and the second case, wherein: the module substrate is inserted into the first case and the second case in a sliding manner and coupled to the first case and the second case, the case includes at least one moving slit in which the external connection terminal is disposed when the first case and the second case are coupled to each other, and the moving slit includes at least one fixing projection inwardly protruded in such a manner that a width of the moving slit is reduced, in a side thereof in which the external connection terminal is finally disposed.
 11. A method of manufacturing a semiconductor module, the method comprising: mounting at least one electronic element and at least one external connection element on a module substrate; disposing a first case and a second case at both ends of the module substrate; and coupling the first case and the second case to the module substrate by moving the first case and the second case so as to contact each other, wherein: the first case and the second case include at least one moving slit in which the external connection terminal is disposed when the first case and the second case are coupled to each other, and the moving slit includes at least one fixing projection inwardly protruded in such a manner that a width of the moving slit is reduced, in a side thereof in which the external connection terminal is finally disposed.
 12. The method of claim 11, wherein the coupling of the first case and the second case to the module substrate includes: coupling the first case and the second case to the module substrate by inserting the module substrate into the first case and the second case in a sliding manner.
 13. The method of claim 11, wherein the coupling of the first case and the second case to the module substrate includes: disposing the module substrate in substrate accommodation parts formed in the first case and the second case and disposing the external connection terminal in the moving slit formed in the first case and the second case.
 14. The method of claim 11, further comprising forming a molding unit by tilling an inside of the case with a molding material. 